UltraPure Steam in Cleaning of Flat Panels
As the substrate size increases, the chemical and water bath usage increases dramatically. Steam cleaning provides a very cost effective method for applying and removing chemistry from the wafer surfaces. The use of steam as a replacement for water can reduce chemical requirements by 1000 fold. In addition, steam can be used to form isolation layers between films and annealing of films to reduce defects and improve cell efficiencies.
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