UltraPure Steam in Steam Cleaning of Wafers
The history of semiconductor capital equipment follows a natural progression from wet to dry processes. As the market for dry processes matures, new markets will evolve. The biggest and most likely to follow is the wet cleaning tools from dip and dunk to dry/vapor cleaning. One issue holding back this space has been the development of an effective vapor cleaning solution. The ability to deliver high flows of ultrapure water vapor is an enabling technology for this next technology advancement. The move from wet to dry could enable a single chamber to be added to existing cluster tools, eliminating the need for a wet bench process.
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