Ultra High Purity Steam in MEMS
Steam is used for the growth of thick and thin oxide films on silicon wafers. RASIRC steam generation and purification technology allows for the elimination of bubblers, direct liquid injection, vaporizers and pyrolytic torches.
Benefits include:
- Reduced operating cost
- Improved uniformity
- Eiminated organic film contamination
- Minimized metallic and particulate
- Dramatically improves safety
- Increased growth rate by up to 18% over bubblers, saving weeks of production time annually
Unlike the pyrolytic process that generates water vapor by combustion of oxygen and hydrogen, RASIRC technology starts with de-ionized water, so it operates at lower temperatures, and can help eliminate hydrogen from the process and facility.
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