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Applications for Ultra High Purity Steam in the Semiconductor Industry

Steam is used for generating oxide films on semiconductor wafers in diffusion and rapid thermal processing. Next generation films require UHP steam for formation of the high K layer. Immersion lithography requires water that is absolutely pure and bubble free. Dilute water vapor can be added to etch, strip, and cleaning process to accelerate reaction rates. RASIRC reduces costs, improves quality, and dramatically improves safety associated with these applications. Unlike the established pyrolytic process that generates water vapor by combustion of oxygen and hydrogen, RASIRC proprietary technology starts with de-ionized water, so it operates at lower temperatures, and can help eliminate hydrogen requirement from a process and facility.



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Additional Information

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Applications

Lithography

Oxidation

VCSELs

RTP

Diffusion

ALD

Wafer Cleaning

 

 
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