Ultra High Purity Steam and Semiconductors
Steam is used for generating oxide films on semiconductor wafers in diffusion and rapid thermal processing. Next generation films require ultra high purity (UHP) steam for formation of the high K layer. Immersion lithography requires water that is absolutely pure and bubble free. Dilute water vapor can be added to the etch, strip, and cleaning process to accelerate reaction rates.
RASIRC reduces costs, improves quality, and dramatically improves safety associated with these applications. Unlike the pyrolytic process that generates water vapor by combustion of oxygen and hydrogen, RASIRC technology starts with de-ionized water, so it operates at lower temperatures, and can help eliminate hydrogen from a process and facility.
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